The Manager of Package Development will be responsible for the identification, evaluation, and implementation of new integrated circuit packages and processes to support growth of existing and new products. The role involves total business ownership from strategic definition to product concept and qualification for cost effective manufacturing.
Responsibilities:
- Identify package and assembly process technologies to improve existing and future packages.
- Supervise a group of packaging/process engineers and direct efforts for improving/implementing both wire bond and bumping technologies.
- Analyze the areas of focus, directions, and relative strengths and weaknesses in order to recommend to management, cost effective plans and programs for strengthening company product objectives.
- Select new package/processes ideas for development implementation. Participate in the definition process with the product and design engineers. Present the business case for each new package and process improvement to company executive management.
- Track the development of new package and process after launch, and provide the leadership to resolve problems and keep the products on schedule.
Requirements:
- BSME/BSMS
- Masters preferred
- 10 years experience in semiconductor assembly processing.
- Self starter, highly motivated to lead fast paced environment
- Team-oriented with good leadership and communication skills.
- Good business sense.
- Willingness to travel, to domestic and international facilities.
- Ability to work effectively in a multi-tasking mode, and to maintain priorities while responding to daily interruptions.
Inquire about this position here.